Circuit Board Materials |
| Adhesive-free, copper-clad laminated sheet for flexible printed circuit board
"ESPANEX" series |
Single-side adhesive-free FPC copper-clad laminated sheet
(single-side CCL) |
Both-side adhesive-free FPC copper-clad laminated sheet
(both-side CCL) |
Liquid crystal polymer copper-clad laminated sheet
"ESPANEX" L series |
|
Semiconductor Packaging Materials |
| Semiconductor packaging material "ESAREX" |
| Dye bonding material |
| Flip chip pressure-welding paste |
| Wafer-level packaging polyimide insulation film |
| Cardo-type insulation film |
|