Nippon Steel Chemical Group
Company Outline Chemicals Electronic Materials Coke&Coal Tar Chemicals
  Circuit Board Materials  Display Device Materials  Organic EL Materials
  Semiconductor Packaging Materials  Major Lines of Business
Electronic Materials
Major Lines of Business

 Circuit Board Materials
Adhesive-free, copper-clad laminated sheet for flexible printed circuit board "ESPANEX" series
•Single-side adhesive-free FPC copper-clad laminated sheet
(single-side CCL)
•Both-side adhesive-free FPC copper-clad laminated sheet
(both-side CCL)
•Liquid crystal polymer copper-clad laminated sheet
"ESPANEX" L series
 Semiconductor Packaging Materials
Semiconductor packaging material "ESAREX"
•Dye bonding material
•Flip chip pressure-welding paste
•Wafer-level packaging polyimide insulation film
•Cardo-type insulation film


 Display Device Materials
Liquid crystal display color filter resist material Organic EL Materials
•Overcoat ink Light emitting material, electron transport material,
hole pouring material, hole transport material
•RGP ink (red, green, blue)
•Black matrix ink
•High Toughness Substrates


ElectornicMaterials: BACK
Circuit Board Materials | Display Device Materials | Organic EL Materials | Semiconductor Packaging Materials | Major Lines of Business

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