| Material |
Product Name |
Features |
| High Performance Film Adhesive Materials |
NEX-130 |
"NEX-130" is a high-performance film adhesive agent developed for use in semiconductor packaging. It is low in CTE ( 20 ppm), high in application reliability and allows void-less packaging by means of low viscous technology. |
| Connecting Paste |
NEX-151 |
"NEX-151" is a non-conductive paste developed for use for the flip-chip NCP method. It has a very long shelf life (one month at room temperature) and features both a short curing time and high application reliability. |
| NEX-181 |
"NEX-181" is a non-conductive paste developed using proprietary thixotropic ratio control technology. It is used in applications requiring control over the flow of adhesion agents in image capping and substrate-substrate joining. |
| NEX-251 |
"NEX-251" is an anisotropic conductive paste developed for use for flip chips. It allows highly reliable packaging on rough surfaces. |
| Underfill Material |
NEX-351 |
"NEX351" is a non-conductive encapsulation material developed as an underfill for flip chips. It has a long port life and is suitable for mass production. This material features a short curing time, exhibits high application reliability and meets the requirements for use with narrow gaps (20μm). |
| High Thermal Conductivity Materials |
NEX-140 |
"NEX-140" is a high-radiation sheet developed for use for power devices. It realizes a thermal conductivity coefficient of 10 W/m_K by means of proprietary high-volume filling technology. |
