Cooperative Customer Relations Support the High-technology Market
With electronic devices
trending toward increasingly
smaller sizes and higher densities, the properties required
of semiconductor packaging materials are becoming steadily
more rigorous. The Nippon Steel Chemical Group attaches
importance not only to providing proprietary resin materials that
meet strict requirements but also to proposing concepts for packaging
methods and conditions. The group even provides customers
with techniques to assess dependability and to analyze and
evaluate defects. The establishment of cooperative customer relations
through such comprehensive support enables the Nippon
Steel Chemical Group to stand at the forefront in the field of semiconductor
packaging.
As for the permanent insulators on printed circuit boards to which
semiconductor chips are mounted, Nippon Steel Chemical has succeeded
in developing a resin that will meet the need for greater
density and higher reliability and promises to achieve super connectivity.
The Nippon Steel Chemical Group is now pushing ahead
with the development of a de facto standard resin for use in the
next-generation of permanent insulators.
