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ESPANEX Dominates the World Market
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The ESPANEX series of
copper-clad lami-nated
sheets (two-layer CCLs) for flexible printed circuit boards was developed
by means of Nippon Steel Chemical's proprietary technology.
This series is unique in that it involves no adhesive due to the
use of low-expansion polyimide. ESPANEX has an excellent reputation
as indispensable not only in the circuit boards for mobile
phones, video cameras etc. but also in the drive circuit boards for
LCDs (liquid crystal displays), where high performance and high
As semiconductors move toward higher densities and higher levels
of integration, requirements are becoming increasingly stringent
with regard to rates of dimensional change, thermal resistance,
electrical properties, mechanical properties etc. ESPANEX, which
enhances these characteristics, has benefited from this trend and
now commands a principal share of the world's two-layer CCL market. |
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Products |
| Pruduct Name |
Features |
ESPANEX M series
 [ High Folding Endurance ]
 [ Fine Pattern Circuit ]
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[ High Folding Endurance ]
ESPANEX M series is featured by new adhesiveless CCL with
originally designed Polyimide, specialized in bending strength.
 [ Fine Pattern Circuit
]
ESPANEX M series is available for 30μm pitch or less(finer) pattern circuit by smooth and flat thin copper with Half etching technology. |
ESPANEX M series
 [ Low Stiffness Type ] |
M series (Low Stiffness Type) features a new adhesiveless Polyimide Thickness 20 μm Type, 12 μm Type and M series (Low Modulus Type) features a new adhesiveless CCL. This substrate benifits assembly in tight spaces due to its high flexibility. |
Liquid Crystal Polymer - CCL ESPANEX L series
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LCP has high temperature capability, low CTE, low moisture absorption, Excellent electrical properties; especially at high frequencies and naturally flame resistance. |
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