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High Thermal Conductivity Materials "ESAREX NEX" |
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| NEX Series (NEX-140) |
| 1.TECHNOLOGIES |
1) High volume filling
2) Process technology of forming film |
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| 2.KEY FEATURES |
1) High Thermal Conductivity
2) High Adhesive Strength
3) High Dielectric Breakdown Strength |
| 3.TYPICAL APPLICATIONS |
1) Heat Radiation Substrate
2) Heat Radiation Sheet |
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Heat Radiation Substrate |
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| Items |
Unit |
NEX-140
Thermal Conductive |
| Thickness |
um |
75-150 |
| Cure Temperature |
deg.C |
180 |
| TMA α1 |
ppm/C |
10 - 20 (T) |
| Tg |
deg.C |
150 (T) |
| Modulus |
GPa |
5 - 6 (T) |
| Strength |
MPa |
50 - 60 (T) |
| Thermal Conductivity |
W/m • K |
3 -10 |
| Adhesive Strength |
kN/m |
1.5- 2.5 (P) |
| Volume Resistivity |
Ω • cm |
>1E15 |
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| (T): Tensile, (P): Peel Strength(kN/m) |
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