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High Performance Film Adhesive Materials "ESAREX NEX" |
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| NEX Series (NEX-130) |
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| 1.TECHNOLOGIES |
1) High volume filling
2) Process technology of forming film |
| 2.KEY FEATURES |
| 1) |
Low CTE |
| 2) |
High Thermal Conductivity, High Electrical Conductivity |
| 3) |
Good Conformability |
| 4) |
Good Processability for Embedding |
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| 3.TYPICAL APPLICATIONS |
D/A Film; Encapsulation;
Stacked Packages;
Embedded Components; etc. |
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| Chip Stacking |
Film Encapsulation |
| Items |
Unit |
NEX-130
Low CTE |
| Thickness |
um |
30-130 |
| Lamination Temperature |
deg.C |
80 |
| Cure Temperature |
deg.C |
180 |
| TMA α1 |
ppm/C |
18 (F) |
| Tg |
deg.C |
165 (F) |
| Modulus |
GPa |
15 (F) |
| Strength |
MPa |
150 (F) |
| Thermal Conductivity |
W/m • K |
0.6 |
| Adhesive Strength |
- |
28 (S) |
| Volume Resistivity |
Ω • cm |
>1E15 |
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| (F): Flexural, (S): Shear Strength(N/mm2) |
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