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Connecting Paste "ESAREX NEX" |
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| NEX Series (NEX-151,181,251: Paste Types) |
| 1.TECHNOLOGIES |
1) Using characteristic hardening system
2) Using highly purified epoxy resin |
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| 2.KEY FEATURES |
1) Dispensable and Screen Printable
2) Good Processability
3) Short Curing Time and Long Shelf Life
4) Excellent Insulation Properties |
| 3.TYPICAL APPLICATIONS |
COF; COB; No-flow Underfill; etc. |
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| Items |
Unit |
NEX-151 (035)
Flip Chip
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NEX-181 (015)
Capping &
Connector-less
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NEX-251 (039)
ACP
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| Viscosity at 5rpm, 25deg.C |
Pa • s |
80 |
70 |
80 |
| Thixotropic Ratio 1rpm/10rpm |
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1.1 |
5.0 |
5.0 |
| Gelling Time / at 150 deg.C |
sec |
30 |
35 |
35 |
| Tg |
deg.C |
120 |
120 |
120 |
| C.T.E (α1) |
ppm/C |
41 |
55 |
55 |
| C.T.E (α2) |
ppm/C |
155 |
200 |
190 |
| Volume Resistance |
Ω • cm |
1E+15 |
1E+15 |
1E+15 |
| Flexural Modulus |
GPa |
6 |
3 |
3 |
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