| High Toughness series,Low CTE series |
| 1.TECHNOLOGY |
1) Proprietary Synthetic Technology by originally designed resin
2) Proprietary Process |
| 2.KEY FEATURES |
1) High heat resistance
2) Low coefficient of expansion
3) High transparency
4) Low birefringence |
| 3.TYPICAL APPLICATIONS |
1) Substrates for Inner Touch Panels
2) Substrates for Photo Sensors |
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