| ESPANEX M series (Low Stiffness Type) |
| Polyimide Thickness 20 μm Type, 12 μm Type and M series (Low Modulus Type) features a new adhesiveless CCL. This substrate benifits assembly in tight spaces due to its high flexibility. |
| 1.TECHNOLOGY |
1) Novel Low Stiffness Polyimide and Low Modulus
(Polyimide thickness 20
μm Type, 12μm Type and M series Low Modulus Type)
,
same as ESPANEX S series CCL
2) Proprietary Stiffness Test System |
| 2.KEY FEATURES |
1) Stiffness of CCL is the same as, or even lower than ESPANEX S series
2) Electro and chemical properties are the same as ESPANEX M series
3) Dimensional stability is the same as ESPANEX M series |
| 3.TYPICAL APPLICATIONS |
1) Hinge FPC for Cell Phone
2) Connecting FPC for Optical Pickup
3) Connecting FPC for smaller sized LCDs |
