| For Fine Pattern Circuit |
| ESPANEX M series is available for 30μm pitch or less(finer) pattern circuit by smooth and flat thin copper with Half etching technology. |
| 1.TECHNOLOGY |
1) Thickness & Surface Control of Copper foil
2) Casting & Laminating Production Technology
3) Fine Pattern Circuit Evaluation Technology |
| 2.KEY FEATURES |
1) Available for Fine Pattern Circuit
2) High-density Mounting by Fine Dimensional Stability
3) Stable Insulation Resistance |
| 3.TYPICAL APPLICATIONS |
1) COF(Chip on Film)
2) PKG(Package) |
