Nippon Steel Chemical Group
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Electronic Materials
Adhesiveless Polyimide Copper Clad Laminate ESPANEX® M series

For High Folding Endurance
ESPANEX M series is featured by new adhesiveless CCL with originally designed Polyimide, specialized in bending strength.
1.TECHNOLOGY 1)  Proprietary Synthetic Technology by originally designed Polyimide
2)  Various Proprietary Folding Endurance Test System
2.KEY FEATURES 1)  Selectivity from elastic Copper Foil for dynamic applications
2)  Selectivity from Thin Thickness Polyimide
3)  Custom Technical Support for FPC Bending Applications
3.TYPICAL APPLICATIONS 1)  Hinge FPC for Cell Phone
2)  Connecting FPC for Optical Pickup
3)  Connecting FPC for smaller sized LCDs

Enabling Technology

Hinge FPC for Cell Phone
Connecting FPC for Optical Pickup

Typical Property



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