| For High Frequency Device |
| 1.TECHNOLOGY |
1) Using LCP for dielectric layer & Low Profile Copper foil for conductive layer
2) Adhesiveless Lamination process |
| 2.KEY FEATURES |
1) Excellent Characteristics at High Frequency (Low-k)
2) High Stability for Humidity
3) Eco. Product (Halogen-free Incombustibility etc.) |
| 3.TYPICAL APPLICATIONS |
1) High Frequency Antenna PWB
2) Optical Link PWB, etc. |
